BCP68T1G transistor equivalent, npn transistor.
* High Current
* The SOT−223 Package Can Be Soldered Using Wave or Reflow
* SOT−223 package ensures level mounting, resulting in improved
thermal conduction, .
The device is housed in the SOT−223 package, which is designed for medium power surface mount applications.
Features
Image gallery
TAGS
Download (Size : 195.17KB)